RF Package Design Engineer (Freelance, Remote)

About the role

We are seeking an experienced RF Package Design Engineer to lead the design of high‑performance RF semiconductor packages from concept through volume production. The role is fully remote and operates on a freelance basis, collaborating closely with IC, RF, PCB, and systems engineers.

Key responsibilities

• Lead the end‑to‑end design and development of RF IC packages.
• Define package architecture, pinouts, ball maps, and board interfaces.
• Perform RF, thermal, and mechanical modelling and simulations.
• Drive package qualification, reliability testing, and failure analysis.
• Collaborate with OSATs, substrate vendors, and cross‑functional engineering teams.
• Support prototype builds, product bring‑up, and manufacturing improvements.

Required profile

• Proven experience with RF IC packaging technologies.
• Strong knowledge of electrical, thermal, and mechanical package simulation.
• Understanding of package assembly, qualification, and manufacturing processes.
• Experience with substrate design and production constraints; volume‑production experience is a plus.
• Excellent communication skills and fluency in English.

Required skills

• RF IC packaging
• Electrical simulation
• Thermal simulation
• Mechanical simulation
• Package qualification
• Reliability testing
• Failure analysis
• Substrate design